The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2015
Filed:
Jun. 08, 2011
Yasuhiro Koyama, Osaka, JP;
Katsuji Kawakami, Osaka, JP;
Mutsuo Kawasaki, Osaka, JP;
Osamu Miyake, Osaka, JP;
Hajime Oda, Osaka, JP;
Keiichi Sawai, Osaka, JP;
Yasuhiro Koyama, Osaka, JP;
Katsuji Kawakami, Osaka, JP;
Mutsuo Kawasaki, Osaka, JP;
Osamu Miyake, Osaka, JP;
Hajime Oda, Osaka, JP;
Keiichi Sawai, Osaka, JP;
Sharp Kabushiki Kaisha, Osaka-shi, JP;
Abstract
The present invention is a method for mounting, on a ceramic substrate (), an LED chip (), in which an upper surface of a positive electrode () is in a higher position than an upper surface of a negative electrode (). The method includes the steps of: (i) laminating resist () on the negative electrode () and the positive electrode () and forming openings (and) in the resist (); (ii) forming bumps (and) in the respective openings (and); (iii) removing the resist (); and (iv) bonding bumps (and) to the ceramic substrate (). A cross-sectional area of the opening () is larger than a cross-sectional area of the opening ().