The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2015
Filed:
Nov. 12, 2012
Novatek Microelectronics Corp., Hsinchu, TW;
Jhih-Siou Cheng, New Taipei, TW;
Tzu-Chiang Lin, Hsinchu, TW;
Chia-En Wu, New Taipei, TW;
Chun-Yung Cho, Hsinchu County, TW;
Cheng-Hung Chen, Hsinchu County, TW;
Ju-Lin Huang, Hsinchu County, TW;
Novatek Microelectronics Corp., Hsinchu, TW;
Abstract
A chip package structure includes a package body, a first lead and a second lead. Elements embedded inside the package body include a core circuit having at least one first connection terminal, at least one ESD protection circuit having at least one second connection terminal, at least one third connection terminal and at least one interconnection structure. The interconnection structure is electrically connected to the second connection terminal and the third connection terminal. The first lead on the package body is electrically connected to the second connection terminal and an external circuit. The second lead on the package body electrically connects the first connection terminal and the third connection terminal. The second lead and the first lead are separate in structure.