The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2015
Filed:
Oct. 25, 2013
Jong Sik Paek, Incheon, KR;
Doo Hyun Park, Gyeonggi-do, KR;
Seong Min Seo, Seoul, KR;
Won Chul DO, Gyeonggi-do, KR;
Pil Je Sung, Seoul, KR;
Jin Hee Park, Seoul, KR;
DO Hyung Kim, Seoul, KR;
IN Bae Park, Seoul, KR;
Chang Min Lee, Busan, KR;
Yong Song, Seoul, KR;
Sunggeun Kang, Gyeonggi-do, KR;
Jong Sik Paek, Incheon, KR;
Doo Hyun Park, Gyeonggi-do, KR;
Seong Min Seo, Seoul, KR;
Won Chul Do, Gyeonggi-do, KR;
Pil Je Sung, Seoul, KR;
Jin Hee Park, Seoul, KR;
Do Hyung Kim, Seoul, KR;
In Bae Park, Seoul, KR;
Chang Min Lee, Busan, KR;
Yong Song, Seoul, KR;
SungGeun Kang, Gyeonggi-do, KR;
Amkor Technology, Inc., Tempe, AZ (US);
Abstract
A semiconductor device utilizing redistribution layers to couple stacked die is disclosed and may include a first semiconductor die with a first surface comprising bond pads, a second surface opposite the first surface, and sloped side surfaces between the first and second surfaces, such that a cross-section of the first die is trapezoidal in shape. A second semiconductor die with a first surface may be bonded to the second surface of the first die, wherein the first surface of the second die may comprise bond pads. A passivation layer may be formed on the first surface and sloped side surfaces of the first die and the first surface of the second die. A redistribution layer may be formed on the passivation layer, electrically coupling bond pads on the first and second die. A conductive pillar may extend from a bond pad on the second die to the second redistribution layer.