The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2015

Filed:

Apr. 24, 2012
Applicants:

Akira Shigekawa, Mishima-gun, JP;

Hideo Nitta, Mishima-gun, JP;

Satoshi Shiota, Mishima-gun, JP;

Inventors:

Akira Shigekawa, Mishima-gun, JP;

Hideo Nitta, Mishima-gun, JP;

Satoshi Shiota, Mishima-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 4/00 (2006.01); G01T 1/20 (2006.01);
U.S. Cl.
CPC ...
G01T 1/2002 (2013.01); G01T 1/2008 (2013.01);
Abstract

A method for producing a dual-array-type scintillator array, comprising forming first and second scintillator sticks having cell portions by providing first and second scintillator substrates with pluralities of grooves and cutting them in directions perpendicular to the grooves; arranging and fixing plural sets of the first and second scintillator sticks with the cell portions downward on a support plate via spacers; removing base portions from the first and second scintillator sticks by grinding to form first and second cell arrays comprising the first and second cells each arranged in line; forming an integral resin-cured assembly by filling the grooves and gaps of the first and second cell arrays with a resin for a reflector, curing the resin, and then removing the support plate; and cutting a resin layer between the first and second cell arrays in adjacent sets to divide the resin-cured assembly to sets of the first and second cell arrays.


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