The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2015
Filed:
Feb. 16, 2012
Yukinao Kaga, Toyama, JP;
Tatsuyuki Saito, Toyama, JP;
Masanori Sakai, Toyama, JP;
Takashi Yokogawa, Toyama, JP;
Yukinao Kaga, Toyama, JP;
Tatsuyuki Saito, Toyama, JP;
Masanori Sakai, Toyama, JP;
Takashi Yokogawa, Toyama, JP;
Hitachi Kokusai Electric Inc., Tokyo, JP;
Abstract
Provided are a semiconductor device manufacturing method and a substrate processing apparatus that are capable of increasing a work function of a film to be formed, in comparison with a related art. A cycle including (a) supplying a metal-containing gas into a processing chamber where a substrate is accommodated (b) supplying a nitrogen-containing gas into the processing chamber; and (c) supplying one of an oxygen-containing gas, a halogen-containing gas and a combination thereof into the processing chamber, is performed a plurality of times to form a metal-containing film on the substrate.