The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2015
Filed:
Oct. 22, 2013
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Jeffrey C. Maling, Grand Isle, VT (US);
Anthony K. Stamper, Williston, VT (US);
Zeljka Topic-Beganovic, Essex Junction, VT (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H01L 23/58 (2006.01); G01R 31/26 (2014.01); H01L 21/66 (2006.01); H01L 23/544 (2006.01); G01N 23/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); G06F 17/5072 (2013.01); G01N 23/20091 (2013.01);
Abstract
Methods, systems, and structures for detecting residual material on semiconductor wafers are provided. A method includes scanning a test structure including topographic features on a surface of a semiconductor wafer. The method further includes determining, based on the scanning, that the test structure includes an amount of a residual material of a sacrificial layer that exceeds a predetermined threshold.