The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

Dec. 17, 2013
Applicant:

Advanced Flexible Circuits Co., Ltd., Taoyuan County, TW;

Inventors:

Gwun-Jin Lin, Taoyuan County, TW;

Kuo-Fu Su, Taoyuan County, TW;

Chih-Heng Chuo, Taoyuan County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 7/38 (2006.01); H01P 1/22 (2006.01); H01P 3/02 (2006.01); H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
H01P 1/22 (2013.01); H03H 7/38 (2013.01); H01P 1/227 (2013.01); H01P 3/026 (2013.01); H05K 1/00 (2013.01);
Abstract

An attenuation reduction control structure for high-frequency signal transmission lines of a flexible circuit board includes an impedance control layer formed on a surface of a substrate. The impedance control layer includes an attenuation reduction pattern that is arranged in an extension direction of the high-frequency signal transmission lines of the substrate and corresponds to bottom angle structures of the high-frequency signal transmission lines in order to improve attenuation of a high-frequency signal transmitted through the high-frequency signal transmission lines. An opposite surface of the substrate includes a conductive shielding layer formed thereon. The conductive shielding layer is formed with an attenuation reduction pattern corresponding to top angle structures of the high-frequency signal transmission lines.


Find Patent Forward Citations

Loading…