The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2015
Filed:
Dec. 23, 2008
Applicants:
Myung Jin Yim, Chandler, AZ (US);
Jason Brand, Placerville, CA (US);
Inventors:
Myung Jin Yim, Chandler, AZ (US);
Jason Brand, Placerville, CA (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/295 (2013.01); H01L 23/3128 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1815 (2013.01); H01L 24/48 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/15311 (2013.01); H01L 2224/45144 (2013.01);
Abstract
A molding compound comprising a resin, a filler, and a carbon nano-tube dispersion is disclosed. The carbon nano-tube dispersion achieves a low average agglomeration size in the molding compound thereby providing desirable electromechanical properties and laser marking compatibility. A shallow laser mark may be formed in a mold cap with a maximum depth of less than 10 microns.