The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

May. 23, 2014
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Shafaat Ahmed, Yorktown Heights, NY (US);

Hariklia Deligianni, Tenafly, NJ (US);

Lubomyr T. Romankiw, Briarcliff Manor, NY (US);

Kejia Wang, Fishkill, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0264 (2006.01); H01L 31/0272 (2006.01); C25D 5/10 (2006.01); C25D 5/50 (2006.01); H01L 21/02 (2006.01); H01L 31/032 (2006.01); H01L 31/072 (2012.01); H01L 31/0224 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0272 (2013.01); C25D 5/10 (2013.01); C25D 5/50 (2013.01); H01L 21/02422 (2013.01); H01L 21/02491 (2013.01); H01L 21/02568 (2013.01); H01L 21/02614 (2013.01); H01L 21/02628 (2013.01); H01L 31/0326 (2013.01); H01L 31/072 (2013.01); H01L 31/0224 (2013.01); H01L 31/18 (2013.01); Y02E 10/50 (2013.01); H01L 2924/10822 (2013.01);
Abstract

Techniques for using electrodeposition to form absorber layers in diodes (e.g., solar cells) are provided. In one aspect, a method for fabricating a diode is provided. The method includes the following steps. A substrate is provided. A backside electrode is formed on the substrate. One or more layers are electrodeposited on the backside electrode, wherein at least one of the layers comprises copper, at least one of the layers comprises zinc and at least one of the layers comprises tin. The layers are annealed in an environment containing a sulfur source to form a p-type CZTS absorber layer on the backside electrode. An n-type semiconductor layer is formed on the CZTS absorber layer. A transparent conductive layer is formed on the n-type semiconductor layer. A diode is also provided.


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