The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2015
Filed:
Mar. 18, 2011
Applicant:
Satoshi Teramae, Hyogo-ken, JP;
Inventor:
Satoshi Teramae, Hyogo-ken, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 25/07 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H01L 23/04 (2006.01); H01L 23/049 (2006.01); H01L 23/24 (2006.01); H05K 3/00 (2006.01); H05K 3/22 (2006.01);
U.S. Cl.
CPC ...
H01L 25/072 (2013.01); H01L 23/04 (2013.01); H01L 23/049 (2013.01); H01L 23/24 (2013.01); H01L 23/3735 (2013.01); H01L 23/49838 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/32238 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83801 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/351 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/014 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/32013 (2013.01); H01L 24/45 (2013.01); H01L 2224/45124 (2013.01); H05K 1/0209 (2013.01); H05K 3/0061 (2013.01); H05K 3/222 (2013.01); H05K 2201/09663 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/1028 (2013.01); H05K 2201/10287 (2013.01);
Abstract
A semiconductor device includes: an insulating substrate; a first electrode pattern and a second electrode pattern provided apart from each other on a major surface of the insulating substrate; a semiconductor element connected to the first electrode pattern; an electrode terminal connected to the second electrode pattern; and a connection wiring. The connection wiring electrically connects the first electrode pattern and the second electrode pattern with each other and has a thermal resistance larger than that of the first electrode pattern.