The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2015
Filed:
May. 29, 2012
Applicants:
Junichi Nakamura, Nagano, JP;
Yuji Kobayashi, Nagano, JP;
Mikio Yamagiwa, Nagano, JP;
Inventors:
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-shi, Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/46 (2006.01); H01L 21/683 (2006.01); H05K 3/20 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0366 (2013.01); H05K 1/036 (2013.01); H05K 3/4655 (2013.01); H01L 21/6835 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/16 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/1517 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15311 (2013.01); H05K 3/205 (2013.01); H05K 3/423 (2013.01); H05K 3/4602 (2013.01); H05K 3/4673 (2013.01); H05K 3/4682 (2013.01); H05K 3/4688 (2013.01); H05K 2203/0152 (2013.01); H05K 2203/0733 (2013.01); H05K 2203/1536 (2013.01);
Abstract
In a multilayered wiring board constituted by laminating to form pluralities of layers of wiring layersand insulating layers, in the plurality of laminated insulating layers, the insulating layerdisposed at a laminating center in a laminating direction is made to constitute an insulating layer with a reinforcing member including a reinforcing member.