The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2015
Filed:
Jul. 11, 2012
Philip H. Bowles, Fountain Hills, AZ (US);
Paige M. Holm, Phoenix, AZ (US);
Stephen R. Hooper, Mesa, AZ (US);
Raymond M. Roop, Scottsdale, AZ (US);
Philip H. Bowles, Fountain Hills, AZ (US);
Paige M. Holm, Phoenix, AZ (US);
Stephen R. Hooper, Mesa, AZ (US);
Raymond M. Roop, Scottsdale, AZ (US);
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Abstract
A method () of forming sensor packages () entails providing a sensor wafer () having sensors () formed on a side () positioned within areas () delineated by bonding perimeters (), and providing a controller wafer () having control circuitry () at one side () and bonding perimeters () on an opposing side (). The bonding perimeters () of the controller wafer () are bonded to corresponding bonding perimeters () of the sensor wafer () to form a stacked wafer structure () in which the control circuitry () faces outwardly. The controller wafer () is sawn to reveal bond pads () on the sensor wafer () which are wire bonded to corresponding bond pads () formed on the same side () of the wafer () as the control circuitry (). The structure () is encapsulated in packaging material () and is singulated to produce the sensor packages ().