The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2015
Filed:
Nov. 17, 2008
Applicant:
Katsumi Sameshima, Kyoto, JP;
Inventor:
Katsumi Sameshima, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/525 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/525 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0361 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/03914 (2013.01); H01L 2224/05017 (2013.01); H01L 2224/05027 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05541 (2013.01); H01L 2224/0556 (2013.01); H01L 2224/05564 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11912 (2013.01); H01L 2224/13006 (2013.01); H01L 2224/13018 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13144 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01074 (2013.01); H01L 2224/05018 (2013.01); H01L 2224/05559 (2013.01);
Abstract
A semiconductor device includes a semiconductor chip, a wiring formed on the semiconductor chip, a passivation film coating the wiring and having an opening for partially exposing the wiring from the passivation film an interposing film formed on a portion of the wiring and facing the opening, and a post bump raisedly formed on the interposing film and with a peripheral edge portion thereof protruding away from the opening more than a peripheral edge of the interposing film in a direction parallel to a surface of the passivation film.