The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2015

Filed:

Feb. 07, 2014
Applicant:

Tsmc Solid State Lighting Ltd., Hsinchu, TW;

Inventors:

Chi-Xiang Tseng, Kaohsiung, TW;

Hsiao-Wen Lee, Hsinchu, TW;

Min-Sheng Wu, Taoyuan County, TW;

Tien-Min Lin, Chiayi, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 33/50 (2013.01); H01L 2933/0041 (2013.01); H01L 2224/13 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs.


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