The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2015
Filed:
Mar. 04, 2014
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Choongbin Yim, Cheonan-si, KR;
Hyeongmun Kang, Seoul, KR;
Taesung Park, Cheonan-si, KR;
Eunchul Ahn, Yongin-si, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); G01R 31/26 (2014.01); H01L 23/544 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/3105 (2013.01);
Abstract
A semiconductor package, comprising: a semiconductor substrate; a mold layer on the semiconductor substrate; and a marking formed on a surface of the mold layer, the marking comprising dot markings substantially discontinuously arranged in vertical and horizontal directions of a display region. An effective area of the dot markings within a unit display region of the marking is smaller than about half a total area of the unit display region.