The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2015
Filed:
Aug. 22, 2007
Hiroshi Yamada, Ebina, JP;
Katsuhiko Kitagawa, Ota, JP;
Kazuo Okada, Ota, JP;
Yuichi Morita, Yokosuka, JP;
Hiroyuki Shinogi, Gifu, JP;
Shinzo Ishibe, Gunma, JP;
Yoshinori Seki, Gunma, JP;
Takashi Noma, Ota, JP;
Hiroshi Yamada, Ebina, JP;
Katsuhiko Kitagawa, Ota, JP;
Kazuo Okada, Ota, JP;
Yuichi Morita, Yokosuka, JP;
Hiroyuki Shinogi, Gifu, JP;
Shinzo Ishibe, Gunma, JP;
Yoshinori Seki, Gunma, JP;
Takashi Noma, Ota, JP;
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Abstract
An object of the invention is to provide a smaller semiconductor device of which the manufacturing process is simplified and the manufacturing cost is reduced and a method of manufacturing the same. Furthermore, an object of the invention is to provide a semiconductor device having a cavity. A first supporting bodyhaving a penetration holepenetrating it from the front surface to the back surface is attached to a front surface of a semiconductor substratewith an adhesive layerbeing interposed therebetween. A device elementand wiring layersare formed on the front surface of the semiconductor substrate. A second supporting bodyis attached to the first supporting bodywith an adhesive layerbeing interposed therebetween so as to cover the penetration hole. The device elementis sealed in a cavitysurrounded by the semiconductor substrate, the first supporting bodyand the second supporting body