The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2015

Filed:

May. 17, 2010
Applicants:

Hideo Tsuchiya, Tokyo, JP;

Fumio Ozaki, Kanagawa, JP;

Inventors:

Hideo Tsuchiya, Tokyo, JP;

Fumio Ozaki, Kanagawa, JP;

Assignees:

NuFlare Technology, Inc., Numazu-shi, JP;

Kabusiki Kaisha Toshiba, Tokyo, JP;

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 1/84 (2012.01); G06T 7/00 (2006.01); G01N 21/956 (2006.01);
U.S. Cl.
CPC ...
G03F 1/84 (2013.01); G06T 7/001 (2013.01); G06T 2207/30148 (2013.01); G01N 21/95607 (2013.01); G01N 2021/95676 (2013.01);
Abstract

The entire surface of a photomaskis inspected after data and parameters of the lithography simulator are set in the operation setting screen of a control computerand after the inspection systemis calibrated. The coordinates of a portion or portions determined in the inspection to be a defect are written into an XML file. When the inspection systemis in the die-to-database inspection mode, the control computerreads pattern data from the database, which data is used by the inspection systemto generate reference data, and then converts the read pattern data into OASIS format, which is highly versatile. The optical image captured by the inspection systemis converted into a bitmap. These data are sent to the lithography simulator, together with simulation operating conditions and the image data that was used to calibrate the inspection system


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