The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2015

Filed:

Feb. 15, 2012
Applicants:

Antony P. Chacko, Greer, SC (US);

Qingping Chen, Simpsonville, SC (US);

Yang Jin, Sozhou, CN;

Philip M. Lessner, Newberry, SC (US);

Randolph S. Hahn, Simpsonville, SC (US);

Yongjian Qiu, Greenville, SC (US);

Keith R. Brenneman, Simpsonville, SC (US);

Inventors:

Antony P. Chacko, Greer, SC (US);

Qingping Chen, Simpsonville, SC (US);

Yang Jin, Sozhou, CN;

Philip M. Lessner, Newberry, SC (US);

Randolph S. Hahn, Simpsonville, SC (US);

Yongjian Qiu, Greenville, SC (US);

Keith R. Brenneman, Simpsonville, SC (US);

Assignee:

Kemet Electronics Corporation, Simpsonville, SC (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/042 (2006.01); H01G 9/00 (2006.01); H01G 9/028 (2006.01); H01G 9/052 (2006.01); H01G 9/15 (2006.01); B82Y 99/00 (2011.01);
U.S. Cl.
CPC ...
H01G 9/0425 (2013.01); Y10T 29/417 (2015.01); Y10T 29/43 (2015.01); H01G 9/0036 (2013.01); H01G 9/028 (2013.01); H01G 9/052 (2013.01); H01G 9/15 (2013.01); B82Y 99/00 (2013.01); Y10S 977/948 (2013.01);
Abstract

A process for preparing a solid electrolytic capacitor comprising application of coverage enhancing catalyst followed by application of a conducting polymer layer wherein the conductive polymeric cathode comprises the coverage enhancement catalyst wherein the conductive polymeric layer has improved coverage of the corners and edges. Coverage enhancing catalyst is removed after coating and curing.


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