The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2015
Filed:
Oct. 12, 2011
Applicants:
Mahmoud Dreiza, Haute Savoie, FR;
Andrew Ballantine, Ain, FR;
Russell Scott Shumway, Mesa, AZ (US);
Inventors:
Assignee:
Amkor Technology, Inc., Chandler, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/04 (2006.01);
U.S. Cl.
CPC ...
H01L 27/04 (2013.01);
Abstract
A molded ring includes a molded cavity of a molded cavity substrate MEMS package. The molded ring is formed by molding a dielectric material directly upon a substrate. As molding is a relatively simple and low cost process, the molded ring and thus molded cavity are formed at a minimal cost. This, in turn, minimizes the cost of the molded cavity substrate MEMS package.
Dreiza, Mahmoud. (2015). Molded cavity substrate mems package fabrication method and structure (U.S. Patent No. 9029962). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9029962
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile