The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2015
Filed:
Jan. 24, 2013
Applicant:
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;
Inventors:
Assignee:
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H05K 3/10 (2006.01); H05K 3/20 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H05K 3/10 (2013.01); H05K 1/0274 (2013.01); H05K 3/0014 (2013.01); H05K 3/0061 (2013.01); H05K 3/205 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/0376 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2054 (2013.01); H05K 2201/09409 (2013.01); H01L 2924/0002 (2013.01); H01L 2224/13 (2013.01);
Abstract
There is provided a wiring substrate. The wiring substrate includes: a heat sink; an insulating member on the heat sink; a wiring pattern embedded in the insulating member and including a first surface and a second surface opposite to the first surface, the second surface contacting the insulating member; and a metal layer on the first surface of the wiring pattern, wherein an exposed surface of the metal layer is flush with an exposed surface of the insulating member.