The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2015

Filed:

Feb. 25, 2011
Applicants:

Motoaki Iwaya, Aichi, JP;

Hiroshi Amano, Aichi, JP;

Isamu Akasaki, Aichi, JP;

Inventors:

Motoaki Iwaya, Aichi, JP;

Hiroshi Amano, Aichi, JP;

Isamu Akasaki, Aichi, JP;

Assignees:

Meijo University, Aichi, JP;

Soko Kagaku Co., Ltd., Aichi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/02 (2006.01); H01L 29/20 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 21/02365 (2013.01); H01L 29/2003 (2013.01); H01L 21/02458 (2013.01); H01L 21/0254 (2013.01); H01L 33/007 (2013.01); H01L 33/0079 (2013.01);
Abstract

A structure includes a substrate, a template layer formed on the surface of the substrate and including an AlN layer, and a device structure portion formed by stacking AlGaN semiconductor layers on the template layer. For the structure, the AlN layer is irradiated from a side close to the substrate with a laser light with a wavelength by which the laser light passes through the substrate and the laser light is absorbed by the AlN layer, in a state in which the AlN layer receives compressive stress from the substrate. This allows the AlN layer to expand more than the surface of the substrate on at least an interface between the AlN layer and the substrate so as to increase the compressive stress, in order to remove the substrate from the AlN layer.


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