The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2015

Filed:

Nov. 02, 2012
Applicant:

Tokyo Ohka Kogyo Co., Ltd., Kawasaki-shi, JP;

Inventors:

Hiroaki Shimizu, Kawasaki, JP;

Tsuyoshi Nakamura, Kawasaki, JP;

Jiro Yokoya, Kawasaki, JP;

Hideto Nito, Kawasaki, JP;

Assignee:

Tokyo Ohka Kogyo Co., Ltd, Kawasaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/039 (2006.01); G03F 7/20 (2006.01); G03F 7/30 (2006.01); G03F 7/38 (2006.01); C08F 220/18 (2006.01); C08F 220/28 (2006.01); C08F 220/36 (2006.01); G03F 7/004 (2006.01); G03F 7/095 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0046 (2013.01); C08F 220/18 (2013.01); C08F 220/28 (2013.01); C08F 220/36 (2013.01); G03F 7/0045 (2013.01); G03F 7/095 (2013.01); G03F 7/2041 (2013.01); G03F 7/38 (2013.01); Y10S 430/106 (2013.01); Y10S 430/12 (2013.01); Y10S 430/121 (2013.01); Y10S 430/122 (2013.01); Y10S 430/123 (2013.01); Y10S 430/126 (2013.01);
Abstract

There are provided a method of forming a resist pattern includes: a step () in which a resist composition containing a base component (A) that generates base upon exposure and exhibits increased solubility in an alkali developing solution by the action of acid is applied to a substrate to form a resist film; a step () in which the resist filmis subjected to exposure; a step () in which baking is conducted after the step (); and a step () in which the resist filmis subjected to an alkali development, thereby forming a negative-tone resist pattern in which the unexposed portionof the resist filmhas been dissolved and removed, and the resist composition used in the step ().


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