The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2015
Filed:
Oct. 02, 2009
Isao Iwayama, Osaka, JP;
Yoshihiro Nakai, Osaka, JP;
Taichiro Nishikawa, Osaka, JP;
Yoshiyuki Takaki, Osaka, JP;
Misato Kusakari, Osaka, JP;
Toshiya Ikeda, Toyama, JP;
Isao Iwayama, Osaka, JP;
Yoshihiro Nakai, Osaka, JP;
Taichiro Nishikawa, Osaka, JP;
Yoshiyuki Takaki, Osaka, JP;
Misato Kusakari, Osaka, JP;
Toshiya Ikeda, Toyama, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
A. L. M. T. Corp., Tokyo, JP;
Abstract
A composite member suitable for a heat radiation member of a semiconductor element and a method of manufacturing the same are provided. This composite member is a composite of magnesium or a magnesium alloy and SiC, and it has porosity lower than 3%. This composite member can be manufactured by forming an oxide film on a surface of raw material SiC, arranging coated SiC having the oxide film formed in a cast, and infiltrating this coated SiC aggregate with a molten metal (magnesium or the magnesium alloy). The porosity of the composite member can be lowered by improving wettability between SiC and the molten metal by forming the oxide film. According to this manufacturing method, a composite member having excellent thermal characteristics such as a coefficient of thermal expansion not lower than 4 ppm/K and not higher than 10 ppm/K and thermal conductivity not lower than 180 W/m·K can be manufactured.