The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2015

Filed:

Oct. 20, 2010
Applicants:

Motoki Okaniwa, Tokyo, JP;

Toshimitsu Kikuchi, Tokyo, JP;

Takaaki Uno, Tokyo, JP;

Takashi Okada, Tokyo, JP;

Inventors:

Motoki Okaniwa, Tokyo, JP;

Toshimitsu Kikuchi, Tokyo, JP;

Takaaki Uno, Tokyo, JP;

Takashi Okada, Tokyo, JP;

Assignee:

JSR Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 65/40 (2006.01); H05K 1/03 (2006.01); C08G 75/23 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0326 (2013.01); C08G 65/40 (2013.01); C08G 65/4006 (2013.01); C08G 75/23 (2013.01); C08G 2650/40 (2013.01); Y10S 428/901 (2013.01);
Abstract

There are provided a substrate for printed wiring excellent in light transmission property, heat resistance, mechanical strength and resistance to thermal coloration; a printed wiring laminate; and a resin composition used to produce the substrate and the laminate. The substrate for printed wiring comprises an aromatic polyether-typed polymer having a glass transition temperature, as measured by differential scanning calorimetry (DSC, heating rate: 20° C./minute), of from 230° C. to 350° C.


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