The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2015

Filed:

Mar. 13, 2013
Applicants:

Tae-joong Song, Seongnam-si, KR;

Pil-un Ko, Hwaseong-si, KR;

Gyu-hong Kim, Seoul, KR;

Jong-hoon Jung, Seoul, KR;

Inventors:

Tae-joong Song, Seongnam-si, KR;

Pil-un Ko, Hwaseong-si, KR;

Gyu-hong Kim, Seoul, KR;

Jong-hoon Jung, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H01L 27/092 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5072 (2013.01); G06F 17/5081 (2013.01); G06F 17/50 (2013.01); H01L 27/092 (2013.01); G06F 17/5077 (2013.01); H01L 27/0207 (2013.01); H01L 27/0924 (2013.01);
Abstract

A semiconductor integrated circuit designing method capable of minimizing a parasitic capacitance generated by an overhead in conductive lines, especially a gate line, a semiconductor integrated circuit according to the designing method, and a fabricating method thereof are provided. A method of designing a semiconductor integrated circuit having a FinFET architecture, includes: performing a pre-simulation of the semiconductor integrated circuit to be designed; designing a layout of components of the semiconductor integrated circuit based on a result of the pre-simulation, the components comprising first and second device areas and a first conductive line extending across the first and second device areas; modifying a first cutting area, that is arranged between the first and second device areas and electrically cuts the first conductive line, according to at least one design rule to minimize an overhead of the first conductive line created by the first cutting area.


Find Patent Forward Citations

Loading…