The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2015

Filed:

Dec. 29, 2011
Applicants:

Jing-en Luan, Singapore, SG;

HK Looi, Singapore, SG;

Inventors:

Jing-En Luan, Singapore, SG;

Hk Looi, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/06 (2006.01); H05K 3/30 (2006.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/305 (2013.01); Y10T 29/4913 (2015.01); H05K 3/321 (2013.01); H05K 3/3421 (2013.01); H05K 2201/09781 (2013.01); H05K 2201/09909 (2013.01);
Abstract

On a circuit substrate on which an adhesive is used to couple electronic or structural components to the substrate, an adhesive dam is positioned to prevent the adhesive from interfering with the operation of the circuit. A contact pad can be provided at a selected location and with a selected shape, and solder deposited on the pad, then reflowed to form the dam. The dam can be a structure soldered to a contact pad, or the dam can be supported at its ends by another structure of the device, so that, at the location where it functions to contain the adhesive, it is not attached to the substrate.


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