The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2015

Filed:

Apr. 23, 2013
Applicant:

Kemet Electronics Corporation, Simpsonville, SC (US);

Inventors:

John Bultitude, Simpsonville, SC (US);

John E. McConnell, Simpsonville, SC (US);

Abhijit Gurav, Simpsonville, SC (US);

Assignee:

Kemet Electronics Corporation, Simpsonville, SC (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/38 (2006.01); H01G 4/40 (2006.01);
U.S. Cl.
CPC ...
H01G 4/38 (2013.01);
Abstract

An improved high capacitance module for multi-layer ceramic capacitors is described. The module contains a flexible substrate comprising at least one first conductive trace and at least one second conductive trace. A first termination trace is in electrical connection with each first trace and a second termination trace is in electrical connection with each second trace. Each capacitor comprises interleaved conductors wherein alternate conductors are terminated to a first external termination and adjacent conductors are terminated to a second external termination. Each capacitor is mounted on the substrate with the first termination in electrical contact with the first trace and the second termination in electrical contact with the second trace. A housing with the substrate is received in the housing. A first lead tab is in electrical contact with the first termination wherein the first lead tab extends from the housing.


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