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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9023913 B1

PDFFull Text
Date of Patent:
May. 05, 2015

Filed:

Dec. 11, 2012

Curable resin composition, curable resin molded body, cured resin molded body, method for producing each of same, and laminate body

Applicant:

Lintec Corporation, Tokyo, JP;

Inventors:

Masaharu Ito, Tokyo, JP;

Wataru Iwaya, Tokyo, JP;

Hironobu Fujimoto, Tokyo, JP;

Naoki Taya, Tokyo, JP;

Assignee:

Lintec Corporation, Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Ling Choi

Assistant Examiner:

Jessica E Whiteley

Int. Cl.
CPC ...
C08F 2/46 (2006.01); C08F 2/50 (2006.01); B29C 71/04 (2006.01); A61L 2/08 (2006.01); A61L 24/00 (2006.01); C08L 33/04 (2006.01); B29C 39/00 (2006.01); C08J 5/18 (2006.01); C08L 35/02 (2006.01); C08L 69/00 (2006.01); C08L 81/06 (2006.01); B29K 33/04 (2006.01); B29K 35/00 (2006.01); B29K 69/00 (2006.01); B29K 81/00 (2006.01); B29K 105/00 (2006.01); B29K 105/24 (2006.01); C08F 226/00 (2006.01); C08F 220/30 (2006.01); C08F 222/10 (2006.01);
U.S. Cl.
CPC ...
C08L 33/04 (2013.01); B29C 39/006 (2013.01); B29K 2033/04 (2013.01); B29K 2035/00 (2013.01); B29K 2069/00 (2013.01); B29K 2081/06 (2013.01); B29K 2105/0002 (2013.01); B29K 2105/0073 (2013.01); B29K 2105/0088 (2013.01); B29K 2105/246 (2013.01); B29K 2867/003 (2013.01); B29K 2995/0017 (2013.01); C08J 5/18 (2013.01); C08J 2333/04 (2013.01); C08J 2335/02 (2013.01); C08J 2369/00 (2013.01); C08J 2381/06 (2013.01); C08J 2433/14 (2013.01); C08J 2435/02 (2013.01); C08J 2439/04 (2013.01); C08J 2481/06 (2013.01); C08L 35/02 (2013.01); C08L 69/00 (2013.01); C08L 81/06 (2013.01); C08F 2/50 (2013.01); C08F 226/00 (2013.01); C08F 2220/301 (2013.01); C08F 2222/1013 (2013.01); C08F 2222/102 (2013.01);
Abstract

The present invention is: a curable resin composition comprising a thermoplastic resin (A), a curable monomer (B), and a photoinitiator (C), the thermoplastic resin (A) including an aromatic ring in its molecule, and having a glass transition temperature (Tg) of 140° C. or more, and the photoinitiator (C) having an absorbance at 380 nm of 0.4 or more when measured in a 0.1 mass % acetonitrile solution; a curable resin formed article obtained by forming the curable resin composition; a cured resin formed article obtained by curing the curable resin formed article; a laminate comprising at least one layer that is formed of a cured resin obtained by curing the curable resin composition. The present invention provides: a cured resin formed article that exhibits excellent heat resistance, includes only a small amount of residual low-boiling-point substance (e.g., solvent and curable monomer), and has small in-plane retardation, a method for producing the same, a curable resin composition and a curable resin formed article that are useful as a raw material for producing the cured resin formed article, and a laminate that includes a layer formed of a cured resin.

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