The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2015

Filed:

Nov. 29, 2011
Applicants:

Satoru Kawai, Ogaki, JP;

Kenji Sakai, Ibi-gun, JP;

Liyi Chen, Ogaki, JP;

Inventors:

Satoru Kawai, Ogaki, JP;

Kenji Sakai, Ibi-gun, JP;

Liyi Chen, Ogaki, JP;

Assignee:

Ibiden Co., Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/10 (2006.01); H05K 3/40 (2006.01); H05K 1/11 (2006.01); H05K 3/20 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4007 (2013.01); H05K 1/113 (2013.01); H05K 3/205 (2013.01); H05K 3/4644 (2013.01); H05K 3/4682 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/09472 (2013.01); H05K 2201/096 (2013.01); H05K 2203/0361 (2013.01);
Abstract

A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a first via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a first conductive circuit formed on the second surface of the resin insulation layer, and a first via conductor formed in the opening and connecting the pad and the first conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion.


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