The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2015
Filed:
Apr. 21, 2014
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
David R Hembree, Boise, ID (US);
Alan G. Wood, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/00 (2006.01); G01R 1/067 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); G01R 1/073 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); G01R 1/06716 (2013.01); G01R 1/07307 (2013.01); H01L 21/486 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/78 (2013.01); H01L 24/85 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/131 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/451 (2013.01); H01L 2224/45116 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/45639 (2013.01); H01L 2224/45644 (2013.01); H01L 2224/45655 (2013.01); H01L 2224/45684 (2013.01); H01L 2224/45698 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48455 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/48475 (2013.01); H01L 2224/4899 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/85051 (2013.01); H01L 2224/85201 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85951 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01088 (2013.01); H01L 2924/014 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/20751 (2013.01); H01L 2924/20752 (2013.01); H01L 2924/20753 (2013.01); H01L 2924/20754 (2013.01); H01L 2924/20755 (2013.01); H01L 2924/20756 (2013.01); H01L 2924/20757 (2013.01); H01L 2924/20758 (2013.01); H01L 2924/20759 (2013.01); H01L 2924/2076 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01033 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/45572 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/4847 (2013.01); H01L 2924/10155 (2013.01); H01L 2924/10161 (2013.01); H01L 2224/48624 (2013.01); H01L 2224/48647 (2013.01); H01L 2224/48824 (2013.01); H01L 2224/48847 (2013.01); H01L 2224/48724 (2013.01); H01L 2224/48747 (2013.01); H01L 2225/1058 (2013.01); H01L 21/76877 (2013.01); H01L 21/76885 (2013.01); H01L 2224/48992 (2013.01); H01L 2224/02335 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2224/02125 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/0333 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/13009 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/05572 (2013.01); H01L 24/81 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/1461 (2013.01);
Abstract
A semiconductor module system includes a module substrate and a semiconductor substrate having a through wire interconnect bonded to an electrode on the module substrate. The through wire interconnect includes a via, a wire in the via having a first end bonded to a substrate contact on the semiconductor substrate and a polymer layer at least partially encapsulating the wire. The semiconductor module system can also include a second substrate stacked on the semiconductor substrate having a second through wire interconnect in electrical contact with the through wire interconnect.