The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2015
Filed:
Jan. 11, 2013
Applicant:
Amkor Technology, Inc., Chandler, AZ (US);
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/50 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/50 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A semiconductor package is presented which has a suitable structure for effectively shielding electromagnetic wave interference (EMI) in a cavity area to which a semiconductor chip is attached. The semiconductor package is assembled such that a lower substrate to which the semiconductor chip is attached is adhered to an EMI shielding & electric I/O body having various types of EMI shielding & electric I/O metal patterns by soldering. Further, the EMI shielding & electric I/O body is adhered to an upper substrate by soldering thereby simplifying assembling of the semiconductor package.