The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2015

Filed:

Nov. 18, 2013
Applicant:

Epistar Corporation, Hsinchu, TW;

Inventors:

Chuan-Cheng Tu, Tainan, TW;

Jen-Chau Wu, Hsinchu, TW;

Yuh-Ren Shieh, Hsinchu County, TW;

Tzer-Perng Chen, Hsinchu, TW;

Min-Hsun Hsieh, Hsinchu, TW;

Assignee:

Epistar Corporation, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/52 (2010.01); H01L 33/00 (2010.01); H01L 33/22 (2010.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 33/52 (2013.01); H01L 33/0079 (2013.01); H01L 33/22 (2013.01); H01L 33/38 (2013.01); H01L 33/0095 (2013.01); H01L 2924/0002 (2013.01); H01L 2224/13 (2013.01);
Abstract

The present disclosure provides a method for forming a light-emitting apparatus, comprising providing a first board having a plurality of first metal contacts, providing a substrate, forming a plurality of light-emitting stacks and trenches on the substrate, wherein the light-emitting stacks are apart from each other by the plurality of the trenches, bonding the light-emitting stacks to the first board, forming an encapsulating material commonly on the plurality of the light-emitting stacks, and cutting the first board and the encapsulating material to form a plurality of chip-scale LED units.


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