The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2015
Filed:
Oct. 28, 2013
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Han-shin Youn, Hwaseong-si, KR;
Yonghwan Kwon, Suwon-si, KR;
YoungHoon Ro, Hwaseong-si, KR;
Woojae Kim, Hwaseong-si, KR;
Sungwoo Park, Anyang-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/58 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/10 (2006.01); H01L 25/16 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/03 (2013.01); H01L 21/563 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 25/105 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/50 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 25/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/1052 (2013.01); H01L 2224/32225 (2013.01);
Abstract
An example embodiment relates to a semiconductor package. The semiconductor package includes a first substrate including a first pad, a second substrate upwardly spaced apart from the first substrate and including a second pad opposite to the first pad. At least one electrode is coupled between the first pad and the second pad. The semiconductor package includes a guide ring formed at a periphery of the electrode between the first substrate and the second substrate.