The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2015

Filed:

Dec. 06, 2013
Applicants:

Philip H. Bowles, Gilbert, AZ (US);

Paige M. Holm, Phoenix, AZ (US);

Stephen R. Hooper, Mesa, AZ (US);

Lianjun Liu, Chandler, AZ (US);

Raymond M. Roop, Paradise Valley, AZ (US);

Inventors:

Philip H. Bowles, Gilbert, AZ (US);

Paige M. Holm, Phoenix, AZ (US);

Stephen R. Hooper, Mesa, AZ (US);

Lianjun Liu, Chandler, AZ (US);

Raymond M. Roop, Paradise Valley, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 7/02 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/02 (2013.01); B81C 1/00293 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01);
Abstract

Embodiments of methods of fabricating a sensor device include attaching first and second die to one another to define first and second cavities in which first and second sensors of the sensor device are disposed, respectively. The second die has an opening in communication with the second cavity. The methods further include obstructing the opening, attaching a third die to the second die. The first cavity is hermetically sealed by attaching the first and second die. The second cavity is hermetically sealed by attaching the third die to the second die.


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