The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2015
Filed:
Dec. 04, 2013
Fujikoshi Machinery Corp., Nagano-shi, Nagano, JP;
National Institute of Advanced Industrial Science and Technology, Tokyo, JP;
Yoshio Nakamura, Nagano, JP;
Yoshio Otsuka, Nagano, JP;
Takashi Okubo, Nagano, JP;
Kazutaka Shibuya, Nagano, JP;
Takayuki Fuse, Nagano, JP;
Shiro Hara, Tsukuba, JP;
Sommawan Khumpuang, Tsukuba, JP;
Shinichi Ikeda, Tsukuba, JP;
Fujikoshi Machinery Corp., Nagano, JP;
National Institute of Advanced Industrial Science and Technology, Tokyo, JP;
Abstract
The wafer polishing apparatus comprises a polishing plate, a polishing head capable of holding a wafer, and a slurry supplying section. The polishing plate includes: a plurality of concentric polishing zones, each of which has a prescribed width for polishing the wafer and on each of which a polishing cloth is adhered; and a groove for discharging slurry being formed between the polishing zones. A head cleaning section, which cleans the polishing head, or a wafer cleaning section, which cleans the polished wafer, is provided to a center part of the polishing plate and located on the inner side of the innermost polishing zone.