The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2015
Filed:
Mar. 11, 2011
Bob Shih-wei Kuo, Chandler, AZ (US);
Brett Arnold Dunlap, Queen Creek, AZ (US);
Louis B. Troche, Jr., Gilbert, AZ (US);
Ahmer Syed, Chandler, AZ (US);
Russell Shumway, Mesa, AZ (US);
Bob Shih-Wei Kuo, Chandler, AZ (US);
Brett Arnold Dunlap, Queen Creek, AZ (US);
Louis B. Troche, Jr., Gilbert, AZ (US);
Ahmer Syed, Chandler, AZ (US);
Russell Shumway, Mesa, AZ (US);
Amkor Technology, Inc., Tempe, AZ (US);
Abstract
A staggered die MEMS package includes a substrate having a converter cavity formed therein. A converter electronic component is mounted within the converter cavity. Further, a MEMS electronic component is mounted to both the substrate and the converter electronic component in a staggered die arrangement. By staggering the MEMS electronic component directly on the converter electronic component instead of locating the MEMS electronic component in a side by side arrangement with the converter electronic component, the total package width of the staggered die MEMS package is minimized. Further, by locating the converter electronic component within the converter cavity and staggering the MEMS electronic component directly on the converter electronic component, the total package height, sometimes called Z-height, of the staggered die MEMS package is minimized.