The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2015

Filed:

Jun. 25, 2013
Applicant:

Mec Company Ltd., Hyogo, JP;

Inventors:

Masayo Kurii, Hyogo, JP;

Kiyoto Tai, Hyogo, JP;

Mami Nakamura, Hyogo, JP;

Yuki Ogino, Hyogo, JP;

Assignee:

Mec Company Ltd., Hyogo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 13/00 (2006.01); C23F 1/18 (2006.01); H05K 3/38 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
C23F 1/18 (2013.01); H05K 3/383 (2013.01); H05K 2203/0789 (2013.01); H05K 3/067 (2013.01); H05K 2203/0307 (2013.01);
Abstract

Disclosed is a microetching solution, a replenishment solution added to said microetching solution and a method for production of a wiring board using said microetching solution. The microetching solution for copper consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, a polymer and a nonionic surfactant. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. In the microetching solution of the present invention, a value of A/B is 2000 to 9000 and a value of A/D is 500 to 9000, where a concentration of the halide ion is A % by weight, a concentration of the polymer is B % by weight and a concentration of the nonionic surfactant is D % by weight. Using this microetching solution, adhesion to a resin or the like can be uniformly maintained even with a low etching amount.


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