The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2015
Filed:
May. 30, 2012
Applicants:
Jordan Peter Ross, Whitesboro, NY (US);
Amanda M. Hartnett, Utica, NY (US);
Inventors:
Jordan Peter Ross, Whitesboro, NY (US);
Amanda M. Hartnett, Utica, NY (US);
Assignee:
Indium Corporation, Clinton, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
B23K 33/00 (2006.01); B23K 31/02 (2006.01); H05K 13/04 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01); H01L 23/10 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0465 (2013.01); H01L 24/83 (2013.01); H01L 2924/15311 (2013.01); H01L 23/36 (2013.01); H01L 23/3736 (2013.01); H01L 2924/01327 (2013.01); H01L 2224/29012 (2013.01); H01L 2224/27334 (2013.01); H01L 23/10 (2013.01); H01L 21/50 (2013.01); H01L 24/16 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/29015 (2013.01); H01L 2224/29018 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83001 (2013.01); H01L 2224/83075 (2013.01); H01L 2224/83136 (2013.01); H01L 2224/8314 (2013.01); H01L 2224/8321 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83455 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/92225 (2013.01); H01L 2224/2711 (2013.01); H01L 2224/29016 (2013.01); H01L 2924/01322 (2013.01);
Abstract
A method is provided for the forming of a metallic solder joint without a liquid flux to create a solder joint that has minimal voids and can be reflowed multiple times without void propagation. This process can be done for any solder alloy, and is most specifically used in the application of first level thermal interface in a IC or micro processor or BGA microprocessor.