The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2015
Filed:
Jun. 22, 2012
Jung-seok Ahn, Seoul, KR;
IL Hwan Kim, Hwaseong-si, KR;
Jung-hwan Kim, Bucheon-si, KR;
Sangwook Park, Hwaseong-si, KR;
Chungsun Lee, Anyang-si, KR;
Kwang-chul Choi, Suwon-si, KR;
Jung-Seok Ahn, Seoul, KR;
Il Hwan Kim, Hwaseong-si, KR;
Jung-Hwan Kim, Bucheon-si, KR;
Sangwook Park, Hwaseong-si, KR;
Chungsun Lee, Anyang-si, KR;
Kwang-chul Choi, Suwon-si, KR;
Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Abstract
Methods of manufacturing a plurality of semiconductor chips are provided. The method may include providing a middle layer between a substrate and a carrier to combine the carrier with the substrate, thinning the substrate; after thinning the substrate, separating the carrier from the substrate; and after the carrier is separated from the substrate, cutting the substrate to form the plurality of semiconductor chips, wherein the middle layer is adhered to the carrier with a first bonding force, and the middle layer is adhered to the substrate with a second bonding force, and wherein the second bonding force is greater than the first bonding force.