The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9006000 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 14, 2015

Filed:

May. 03, 2012
Applicants:

Deny Hanan, Kfar Harif, IL;

Eddie Redmard, Netanya, IL;

Itai Dror, Omer, IL;

Inventors:

Deny Hanan, Kfar Harif, IL;

Eddie Redmard, Netanya, IL;

Itai Dror, Omer, IL;

Assignee:

SanDisk Technologies Inc., Plano, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); G01R 31/28 (2006.01); G01R 31/26 (2014.01);
U.S. Cl.
CPC ...
G01R 31/2884 (2013.01); G01R 31/2644 (2013.01);
Abstract

A semiconductor device, such as a semiconductor die, is disclosed including embedded temperature sensors for scanning the junction temperature, Tj, at one or more locations of the semiconductor die while the die is operating. Once a temperature of a hot spot is detected that is above a temperature specified for the die or package containing the die, the die/package may be discarded. Alternatively, the functionality of the die may be altered in a way that reduces the temperature of the hot spots.


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