The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2015
Filed:
Jan. 25, 2013
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Torsten Groening, Paderborn, DE;
Mark Essert, Lippstadt, DE;
Christian Steininger, Soest, DE;
Roman Lennart Tschirbs, Soest, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/24 (2006.01); H01L 23/40 (2006.01); H01L 21/50 (2006.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/40 (2013.01); H01L 21/50 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 21/4878 (2013.01); H01L 23/3121 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A power semiconductor module includes a baseplate having a top side, an underside, and a depression formed in the baseplate. The depression extends into the baseplate proceeding from the top side. A thickness of the baseplate is locally reduced in a region of the depression. The power semiconductor module further includes a circuit carrier arranged above the depression on the top side of the baseplate such that the depression is interposed between the circuit carrier and the underside of the baseplate.