The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2015

Filed:

Mar. 01, 2012
Applicants:

Chun-yen Chang, Hsinchu County, TW;

Po-min Tu, Chiayi County, TW;

Jet-rung Chang, Taichung, TW;

Inventors:

Chun-Yen Chang, Hsinchu County, TW;

Po-Min Tu, Chiayi County, TW;

Jet-Rung Chang, Taichung, TW;

Assignee:

Design Express Limited, Tortola, VG;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H01L 29/06 (2006.01); H01L 33/00 (2010.01); H01L 33/32 (2010.01); H01L 33/08 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0079 (2013.01); H01L 33/08 (2013.01); H01L 29/06 (2013.01); H01L 33/60 (2013.01); H01L 33/32 (2013.01);
Abstract

A semiconductor structure includes a temporary substrate; a first semiconductor layer positioned on the temporary substrate; a dielectric layer comprising a plurality of patterned nano-scaled protrusions disposed on the first semiconductor layer; a dielectric layer surrounding the plurality of patterned nano-scaled protrusions and disposed on the first semiconductor layer; and a second semiconductor layer positioned on the dielectric layer, wherein the top surfaces of the patterned nano-scaled protrusions are in contact with the bottom of the second semiconductor layer. An etching process is performed on the semiconductor structure to separate the first semiconductor layer and the second semiconductor layer, in order to detach the temporary substrate from the second semiconductor layer and transfer the second semiconductor layer to a permanent substrate.


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