The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2015

Filed:

Jul. 21, 2010
Applicants:

Min-hsun Hsieh, Hsinchu, TW;

Cheng-nan Han, Hsinchu, TW;

Steve Meng-yuan Hong, Hsinchu, TW;

Hsin-mao Liu, Hsinchu, TW;

Tsung-xian Lee, Hsinchu, TW;

Inventors:

Min-Hsun Hsieh, Hsinchu, TW;

Cheng-Nan Han, Hsinchu, TW;

Steve Meng-Yuan Hong, Hsinchu, TW;

Hsin-Mao Liu, Hsinchu, TW;

Tsung-Xian Lee, Hsinchu, TW;

Assignee:

Epistar Corporation, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/50 (2010.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 33/00 (2010.01); H01L 33/40 (2010.01);
U.S. Cl.
CPC ...
H01L 33/508 (2013.01); H01L 21/6835 (2013.01); H01L 24/24 (2013.01); H01L 24/49 (2013.01); H01L 24/82 (2013.01); H01L 24/96 (2013.01); H01L 24/45 (2013.01); H01L 25/0753 (2013.01); H01L 25/0756 (2013.01); H01L 33/0079 (2013.01); H01L 33/405 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/4918 (2013.01); H01L 2224/92 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01007 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/01031 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01094 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/10349 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/014 (2013.01);
Abstract

A method of making an optoelectronic system in accordance with the present disclosure is disclosed. The method includes providing a temporary substrate; providing un-packaged optoelectronic elements having sidewalls, top surfaces, and bottom surfaces, at least one of the unpackaged optoelectronic elements having an electrode provided on a side of the bottom surfaces; attaching the bottom surfaces to the temporary substrate such that a trench is formed between two of the un-packaged optoelectronic elements; providing an adhesive material to fully fill the trench and cover the un-packaged optoelectronic elements such that the sidewalls and top surfaces of the un-packaged optoelectronic elements are fully enclosed by the adhesive material; providing a transparent substrate on the adhesive material; and removing the temporary substrate without removing all the adhesive material covering the optoelectronic elements.


Find Patent Forward Citations

Hsieh, Min-Hsun. (2015). Optoelectronic system (U.S. Patent No. 8999736). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8999736

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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