The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2015

Filed:

Jul. 09, 2012
Applicants:

Ying Yu, Singapore, SG;

Tienchoy Loh, Singapore, SG;

Shianyeu Kam, Singapore, SG;

Inventors:

Ying Yu, Singapore, SG;

TienChoy Loh, Singapore, SG;

ShianYeu Kam, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/10 (2006.01); B05D 5/02 (2006.01); C03C 17/32 (2006.01); G01N 33/487 (2006.01);
U.S. Cl.
CPC ...
C03C 17/32 (2013.01); G01N 33/4875 (2013.01); G01N 2203/0091 (2013.01);
Abstract

The present disclosure is directed to systems and methods for adjusting adhesion strength between materials during semiconductor sensor processing. One or more embodiments are directed to using various surface treatments to a substrate to adjust adhesion strength between the substrate and a polymer. In one embodiment, the surface of the substrate is roughened to decrease the adhesive strength between the substrate and the polymer. In another embodiment, the surface of the substrate is smoothed to increase the adhesive strength between the substrate and the polymer.


Find Patent Forward Citations

Yu, Ying. (2015). Methods for adjusting adhesion strength during sensor processing (U.S. Patent No. 8999446). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8999446

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…