The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2015
Filed:
Apr. 29, 2013
Applicant:
Stmicroelectronics SA, Montrouge, FR;
Inventors:
Sylvain Joblot, Bizonnes, FR;
Pierre Bar, Grenoble, FR;
Assignee:
STMicroelectronics SA, Montrouge, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/28 (2006.01); H01L 21/768 (2006.01); H01L 23/538 (2006.01); H01L 23/14 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/28 (2013.01); H01L 23/481 (2013.01); H01L 21/76877 (2013.01); H01L 23/5384 (2013.01); H01L 23/147 (2013.01); H01L 23/49822 (2013.01); H01L 21/486 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16225 (2013.01);
Abstract
A chip provided with through vias wherein the vias are formed of an opening with insulated walls coated with a conductive material and filled with an easily deformable insulating material, elements of connection to another chip being arranged in front of the easily deformable insulating material.