The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2015
Filed:
Dec. 21, 2012
Takuya Kadoguchi, Toyota, JP;
Shingo Iwasaki, Toyota, JP;
Tomohiro Miyazaki, Seto, JP;
Masayoshi Nishihata, Chiryu, JP;
Tomomi Okumura, Anjo, JP;
Takuya Kadoguchi, Toyota, JP;
Shingo Iwasaki, Toyota, JP;
Tomohiro Miyazaki, Seto, JP;
Masayoshi Nishihata, Chiryu, JP;
Tomomi Okumura, Anjo, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota-Shi, JP;
Denso Corporation, Kariya-Shi, JP;
Abstract
A semiconductor device includes a plurality of semiconductor elements each having a front surface and a back surface; a front surface-side heatsink that is positioned on a front-surface side of the semiconductor elements and dissipates heat generated by the semiconductor elements; a back surface-side heatsink that is positioned on a back surface-side of the semiconductor elements and dissipates heat generated by the semiconductor elements; a sealing material that covers the semiconductor device except for a front surface of the front surface-side heatsink and a back surface of the back surface-side heatsink; a primer that is coated on at least one of the front surface-side heatsink and the back surface-side heatsink and improves contact with the sealing member; and a protruding portion positioned between the plurality of semiconductor elements, on at least one of the back surface of the front surface-side heatsink and the front surface of the back surface-side heatsink.