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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8994164 B1

PDFFull Text
Date of Patent:
Mar. 31, 2015

Filed:

Sep. 12, 2012

Semiconductor device and semiconductor device manufacturing method

Applicants:

Hideaki Takahashi, Omachi, JP;

Tatsuya Karasawa, Shiojiri, JP;

Yo Sakamoto, Matsumoto, JP;

Inventors:

Hideaki Takahashi, Omachi, JP;

Tatsuya Karasawa, Shiojiri, JP;

Yo Sakamoto, Matsumoto, JP;

Assignee:

Fuji Electric Co., Ltd., Kawasaki-Shi, JP;

Attorney:

Manabu Kanesaka

Primary Examiner:

Fernando L Toledo

Assistant Examiner:

Bryan Junge

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H05K 5/00 (2006.01); H05K 7/06 (2006.01); H01L 23/057 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H05K 5/00 (2013.01); H05K 7/06 (2013.01); H01L 23/49811 (2013.01); H01L 23/057 (2013.01); H01L 21/4875 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A semiconductor device includes an insulating substrate having a semiconductor element mounted thereon; an outer case accommodating the insulating substrate; and a metallic terminal bar disposed above the insulating substrate and fixed to side walls of the outer case at both ends thereof. Each of both ends of the terminal bar at a position close to the side wall of the outer case at a surface on an opposite side to a surface facing the insulating substrate is provided with a pressed groove.

Find Patent Forward Citations

Takahashi, Hideaki. (2015). Semiconductor device and semiconductor device manufacturing method (U.S. Patent No. 8994164). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8994164

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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