The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2015
Filed:
Sep. 12, 2012
Applicants:
Hideaki Takahashi, Omachi, JP;
Tatsuya Karasawa, Shiojiri, JP;
Yo Sakamoto, Matsumoto, JP;
Inventors:
Assignee:
Fuji Electric Co., Ltd., Kawasaki-Shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H05K 5/00 (2006.01); H05K 7/06 (2006.01); H01L 23/057 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H05K 5/00 (2013.01); H05K 7/06 (2013.01); H01L 23/49811 (2013.01); H01L 23/057 (2013.01); H01L 21/4875 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor device includes an insulating substrate having a semiconductor element mounted thereon; an outer case accommodating the insulating substrate; and a metallic terminal bar disposed above the insulating substrate and fixed to side walls of the outer case at both ends thereof. Each of both ends of the terminal bar at a position close to the side wall of the outer case at a surface on an opposite side to a surface facing the insulating substrate is provided with a pressed groove.