The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Jan. 10, 2011
Applicant:

Arnd Ten Have, Dortmund, DE;

Inventor:

Arnd Ten Have, Dortmund, DE;

Assignee:

ELMOS Semiconductor AG, Dortmund, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 9/00 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00158 (2013.01); B81B 3/0018 (2013.01); B81B 3/0021 (2013.01); B81B 3/007 (2013.01); B81B 3/0072 (2013.01); B81B 3/0081 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81C 1/00626 (2013.01); B81C 2201/019 (2013.01); G01L 9/0047 (2013.01);
Abstract

The micro-electromechanical semiconductor component is provided with a semiconductor substrate in which a cavity is formed, which is delimited by lateral walls and by a top and a bottom wall. In order to form a flexible connection to the region of the semiconductor substrate, the top or bottom wall is provided with trenches around the cavity, and bending webs are formed between said trenches. At least one measuring element that is sensitive to mechanical stresses is formed within at least one of said bending webs. Within the central region surrounded by the trenches, the top or bottom wall comprises a plurality of depressions reducing the mass of the central region and a plurality of stiffening braces separating the depressions.


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