The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Jun. 18, 2013
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Kelvin Chan, San Ramon, CA (US);

Jin Xu, Fremont, CA (US);

Kang Sub Yim, Palo Alto, CA (US);

Alexandros T. Demos, Fremont, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/3065 (2006.01); H01L 21/3105 (2006.01); C23C 16/56 (2006.01); H01L 21/67 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3065 (2013.01); H01L 21/02126 (2013.01); H01L 21/02203 (2013.01); H01L 21/3105 (2013.01); C23C 16/56 (2013.01); H01L 21/67115 (2013.01); H01L 21/6719 (2013.01); H01L 21/76814 (2013.01); H01L 21/7682 (2013.01); H01L 21/76825 (2013.01); H01L 21/76826 (2013.01); H01L 2221/1047 (2013.01);
Abstract

Embodiments of the present invention generally relate to methods for lowering the dielectric constant of low-k dielectric films used in semiconductor fabrication. In one embodiment, a method for lowering the dielectric constant (k) of a low-k silicon-containing dielectric film, comprising exposing a porous low-k silicon-containing dielectric film to a hydrofluoric acid solution and subsequently exposing the low-k silicon-containing dielectric film to a silylation agent. The silylation agent reacts with Si—OH functional groups in the porous low-k dielectric film to increase the concentration of carbon in the low-k dielectric film.


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