The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Jul. 23, 2013
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Hideaki Masuda, New York City, NY (US);

Kei Watanabe, Tokyo, JP;

Kenichi Ootsuka, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01); H01L 21/314 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02697 (2013.01); H01L 21/02074 (2013.01); H01L 21/02167 (2013.01); H01L 21/02274 (2013.01); H01L 21/02304 (2013.01); H01L 21/02312 (2013.01); H01L 21/3105 (2013.01); H01L 21/3148 (2013.01); H01L 21/76826 (2013.01); H01L 21/76829 (2013.01); H01L 21/76834 (2013.01); H01L 21/76883 (2013.01);
Abstract

A method of manufacturing a semiconductor device according to an embodiment, includes forming a wiring in a surface of a first insulating film on a semiconductor substrate, exposing the first insulating film in whose surface the wiring is formed to a plasma containing a rare gas so as to form a densified layer on the surface of the first insulating film, removing an oxide film formed on the wiring, after the densified layer is formed and forming a second insulating film on the wiring from which the oxide film is removed and on the densified layer, wherein the processes from the removal of the oxide film to the formation of the second insulating film are carried out without being atmospherically-exposed.


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